Leardon Solutions utilizes tier 1 global product development strategies to engineer products that meet functional requirements with design margin and are ready for production. The Leardon Solutions team follows a rigorous stage gate development process to achieve a final product that meets the product requirements. Here are some examples of the team’s capabilities:

  • Electronics packaging design
  • Case part design
  • Mechanism and machine design
  • Plastic, elastomer, metal, and sheet metal part design
  • Material and manufacturing process selection, DfM, DfA, DfX
  • Cost reduction redesign
  • Design margin, thermal, stress, and tolerance stack analysis
  • Assembly jig and measurement fixture design and fabrication
  • Embedded systems, analog, high speed digital circuit design
  • Circuit simulation
  • High speed I/O, digital signal processing
  • LCD, color graphics displays, user interface technologies, video
  • Control systems and servo mechanisms
  • Wireless and RF design
  • PCB layout and design for EMC and manufacturing
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